
Nationwide
Semiconductor wafer production requires high-purity argon of 99.999% or above for monocrystalline silicon growth, chip etching and ion implantation processes. Argon acts as an inert protective gas to isolate oxygen and water vapor, ensuring the ultra-high purity of the nanoscale chip production environment.
Our high-purity storage tank has a secondary purification device, and the output argon purity can reach 99.9999%, meeting the production requirements of chips below 14nm; pressure fluctuation is ≤±0.005MPa, so pressure fluctuation will not affect the chip etching process.